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DFS-200, BMR Technology Corporation’s plasma
asher, is a downstream plasma asher designed for
plasma-damage-free photoresist ashing based on
proprietary inductively coupled plasma technology.
Its unique capability of tight wafer temperature control
makes DFS-200 particularly useful for photoresist
ashing of temperature sensitive devices.
DFS-200’s fully automated vacuum cassette wafer
loading system provides cost-effective high throughput
photoresist ashing for mass production. |
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 Proprietary Inductively Coupled Plasma (ICP)
Technology |
| Low DC & RF plasma potentials |
| Downstream plasma with an optional ion grid |
| Plasma-damage-free photoresist ashing with high ashing rate |
| Electrostatic Chuck for accurate control of wafer temperature |
Low temperature process (<100 ) capability for temperature sensitive microelectronics devices. |
| Vacuum cassette wafer loading system |
| Accurate process pressure control |
| Easy-to-use control software with a recipe editor |
| Ideal for cost-effective mass production |
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| Process chamber made of 6061-T6 Aluminum billet |
| Up to 200mm wafer |
| Patented inductively coupled plasma source (ICP) for
efficient generation of oxygen radicals. |
| Proprietary electrostatic filed shield for true inductive
coupling of RF power to plasma to prevent plasma damage due to electrostatic fields |
Optional ion shield to prevent ion-induced plasma damage
Dry vacuum pump |
Controllable process pressure ( 200mTorr ~ 5 Torr )
1.2 KW RF Power Supply @ 13.56MHz with an automatic match network |
| Bipolar type electrostatic wafer
clamping |
| Wafer temperature controllable from room temperature to 200 |
| Two Mass Flow controlled gas lines |
Photoresist ashing rate > 7500 /min. |
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| Windows 2000 based graphic user interface (GUI) |
| Automatically controlled 25 wafer cassette loading in vacuum. |
| A dedicated dual-stage rotary vane pump for cassette loading chamber |
| SECS I, II/GEM Interface |
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